SyChip Introduces High-Speed WLAN SDIO Driver

SyChip Introduces High-Speed WLAN SDIO Driver

October 23, 2007

Solution Enables True Broadband Connectivity In Handheld
Devices


    PLANO, Texas, Oct. 23 /Xinhua-PRNewswire/ -- SyChip,
Inc., a leader in Radio Frequency Chip Scale Modules (CSM)
and a subsidiary of Murata Manufacturing Co., Ltd., today
announced the launch of its High-Speed Secure Digital
Input/Output (HS-SDIO) driver for Wi-Fi enabled mobile
devices.  This HS-SDIO solution allows consumers using
Microsoft(R) Windows CE devices to realize effective data
throughput of up to 16Mbps, thus enabling true high speed
Internet access on a mobile handset.  

    SyChip's HS-SDIO driver doubles the wireless LAN (WLAN)
throughput in current Windows CE devices. Since SDIO is the
most popular interface used in mobile embedded WLAN today,
this driver, together with the company's WLAN module,
provides designers a high performance wireless solution
that can be quickly integrated into handheld device. The
HS-SDIO driver is initially available on the Marvell(R)
PXA270 and PXA300 family of processors, but it can also
support other application processor platforms.

    "The goal is to provide our customers with
industry-leading plug-and-play solutions.  This consists of
smallest form factor modules, with proven software that
decreases time to market and improves the end-user
experience," said Moses Asom, SyChip co-founder and
senior vice president of marketing and business
development.  "We serve as a solution provider
integrating application processors, operating systems and
peripheral interfaces. The HS-SDIO product announcement
underscores SyChip's commitment to this strategy."

    "SyChip's high-speed SDIO solution delivers
enhanced performance to designers creating devices running
Windows Embedded CE," said Jeff Felbeck, senior
partner marketing manager, Americas at Microsoft Corp.
"With this increased performance, SyChip is
contributing to the connected experience powered by smart,
service-oriented devices with high-speed flexibility and
connectivity."

    The HS-SDIO product will be commercially available in
Q4 2007.  Interested customers can visit
http://www.sychip.com/products.html for more information
and pricing.

    About SyChip, Inc.

    SyChip, Inc. a subsidiary of Murata Manufacturing Co.,
Ltd. develops and markets Chip Scale Modules,
Semiconductors and Software for the wireless mobile market.
The company's RF modules are differentiated due to
proprietary integration and low loss silicon technologies.
As a result of this integration, world-class RF system
design, proprietary multifunction ASICs, software and smart
utilities, SyChip's RF designs drastically reduce component
count, offer very small footprints and are easy to
integrate into a mobile device. Customers benefit by
significantly reducing their time-to-market, increasing
performance and improving reliability of their wireless
devices. SyChip has received multiple awards, including
Internet Telephony's 2005 Product of the Year, Deloitte's
2005 "Fast 500", the TiEcon 2005 Emerging Star
Award, MobileTrax "2005 Mobility Award", finalist
for the "2005 Red Herring 100", Deloitte's 2004
"Fast 500 Rising Star Award" and "Best
Wireless Accessory" by Handheld Computing.

    All product and company names herein may be trademarks
of their registered owners.


    For more information, please contact:

    Company Contact:  
     Yong Fang 
     SyChip, Inc.
     Tel:   [phone]
     Email: [e-mail]

    Media Contact: 
     Amy Talley 
     Jefferson Communications
     Tel:   [phone]
     Email: [e-mail]

     Web site: http://www.sychip.com/products.html