Carsem Selects Eagle Test Systems for Parallel Mixed-Signal and Analog Test

Carsem Selects Eagle Test Systems for Parallel Mixed-Signal and Analog Test

September 01, 2007

    BUFFALO GROVE, Ill., Aug. 31
/Xinhua-PRNewswire-FirstCall/ -- 

    Eagle Test Systems, Inc. (Nasdaq: EGLT), announced that
Carsem, a leading provider of turn-key assembly and test
services including wafer probe, final test, product
engineering and test program/hardware development for the
semiconductor industry, has selected Eagle Test Systems as
their mixed-signal and analog platform of choice for true
parallel multi-site test.   

    Carsem plans to utilize the Eagle Test platform in
their development and production facilities for Power
Management, Industrial, Automotive, and some Data Converter
device test applications.  Eagle Test was chosen based on a
set of Carsem specific criteria which includes installed
base, long term viability, OEE performance, test economics,
and global support capabilities.

    "The Eagle Test platform enables us to offer
parallel, multi-site testing to address a wide range of
customers' products with superior cost-of-test
economics," said WT Chim, General Manager of Test
Operations for Carsem Malaysia.  "Eagle's parallel
capabilities were a key factor in our decision process.
With multiple facilities in Malaysia and China, Eagle
continues to demonstrate their commitment to Carsem's
success." 

    "Since Carsem is a major player in the assembly
and test of MLP products, the decision to name Eagle their
platform of choice speaks very highly of our ability to
deliver high volume test solutions," stated Dale
Buxton, Vice President Asian Operations for Eagle Test. 
"We consider Carsem to be an extremely valuable
relationship and look forward to sharing continued
success."

    About Eagle Test Systems, Inc.

    Eagle Test designs, manufactures, sells and services
high-performance automated test equipment for the
semiconductor industry. The company's products are used to
test analog, mixed-signal and radio frequency (RF)
semiconductors that are used in products such as digital
cameras, MP3 players, automotive electronics, cellular
telephones, computers and peripherals. The company was
founded in 1976 and has offices located throughout the
world in Asia, North America and Europe, with corporate
headquarters in Buffalo Grove, Illinois. Please visit
http://www.eagletest.com for more information.

    About Carsem

    Carsem is a leading provider of turnkey packaging and
test services to the semiconductor industry, and offers one
of the widest ranges of package & test portfolios in the
world. To meet the growing demands of the telecommunications
and wireless markets for smaller, faster,
thermally-efficient devices, Carsem's portfolio includes
several advanced technologies, such as the Micro Leadframe
Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip
Chip On Leadframe (FCOL), and a SiP (System-in-Package)
capability. Carsem also offers a full range of turnkey test
services for RF, mixed-signal, linear, digital and power
devices. Our factories maintain world-class quality
standards having achieved SAC Level 1, ISO-9001, ISO-14001,
QS-9000, TS16949 certifications, and are supported with a
global network of sales and engineering support offices.
Carsem is a member of the Hong Leong Group with factories
located in Ipoh, Malaysia, Suzhou, China and sales offices
across the USA, plus the UK and Taiwan. Carsem, Inc. sales
headquarters is located at 269 Mt. Hermon Road, Suite 104,
Scotts Valley, CA 95066, phone [phone], fax (831)
438-6863, web site: http://www.carsem.com.


     For more information, please contact:

      Stephen Hawrysz  
      Phone: [phone]
      Website:  http://www.eagletest.com 
                http://www.carsem.com